2RB-5 Series 5.5x6mm 10kA GDT Gas Discharge Tube Surge Protector
for Frequency Drivers VFDs
Description
GDT is placed in front of, and in parallel with, sensitive telecom
equipment such as power lines, communication lines, signal lines
and data transmission lines to help protect them from damage caused
by transient surge voltages that may result from lightning strikes
and equipment switching operations. These devices do not influence
the signal in normal operation.
However, in the event of an overvoltage surge, such as a lightning
strike, the GDT switches to a low impedance state and diverts the
energy away from the sensitive equipment.
Our GDT offer a high level of surge protection, a broad voltage
range, low capacitance, and many form factors including new surface
mount devices, which makes them suitable for applications such as
Main Distribution Frame (MDF) modules, high data-rate telecom
applications (e.g. ADSL, VDSL), and surge protection on power
lines. Their low capacitance also results in less signal
distortion. When used in a coordinated circuit protection solution
with PolySwitch devices, they can help equipment manufacturers meet
stringent safety regulatory standards.
Features
Excellent response to fast rising transients
Stable breakdown voltage
GHz working frequency
8/20μs Impulse current capability: 10KA
Non-Radioactive
Ultra Low capacitance (<1pF)
Lead-free compliant
RoHS and REACH compliant
UL 497B Recognized: E465335
Size: Ф5.5mm*6mm
Storage and operational temperature: -40~+90°C
Applications
CATV equipment
Antennas
RS 485
Telecom Base Station
Power Supply AC Main
EV power Charging
Inverter/Variable
Frequency Drivers (VFDs)
IEEE 802.3 compliant Ethernet interfaces
Broad Band equipment
xDSL, ADSL, ADSL2, VDSL, and VDSL2
Medical Electronics
Test Equipment
General Telecom Equipment
Renewable Energy
Part Number Code
Electrical Characteristics
| Part Number | DC
Spark-over Voltage 1) 2) @100V/S | Impulse Spark-over Voltage | Insulation Resistance
3) | Capacitance @1MHz | Life Ratings |
| Impulse Discharge Current @8/20μS | AC Discharge Current @50Hz 1S | Impulse Life @10/1000μS 100A |
| 100V/μS | 1KV/μS |
| Max | Max | Min | Max | Nominal
±5 times | Max 1 time | Nominal 5 times | Min |
| DIP | SMD | V | V | V | GΩ | pF | KA | KA | A | Times |
| 2R075TB-5 | 2R075SB-5 | 75±20% | 500 | 600 | 1 | 1 | 10 | 12 | 10 | 300 |
| 2R090TB-5 | 2R090SB-5 | 90±20% | 500 | 600 | 1 | 1 | 10 | 12 | 10 | 300 |
| 2R150TB-5 | 2R150SB-5 | 150±20% | 500 | 600 | 1 | 1 | 10 | 12 | 10 | 300 |
| 2R230TB-5 | 2R230SB-5 | 230±20% | 600 | 700 | 1 | 1 | 10 | 12 | 10 | 300 |
| 2R250TB-5 | 2R250SB-5 | 250±20% | 600 | 700 | 1 | 1 | 10 | 12 | 10 | 300 |
| 2R300TB-5 | 2R300SB-5 | 300±20% | 750 | 850 | 1 | 1 | 10 | 12 | 10 | 300 |
| 2R350TB-5 | 2R350SB-5 | 350±20% | 800 | 900 | 1 | 1 | 10 | 12 | 10 | 300 |
| 2R420TB-5 | 2R420SB-5 | 420±20% | 850 | 950 | 1 | 1 | 10 | 12 | 10 | 300 |
| | | | | | | | | 10 | 300 |
| Glow Voltage at
10mA........................................................................
~60V |
| Arc Voltage at 1A ~10V |
| Glow to Arc transition Current………………………………………...... ~0.5A |
Weight…………………………………………………………………...... DIP ~0.82g
SMD ~0.55g |
| Operation and storage temperature……………………………………. -40~+90°C |
| Climatic category (IEC 60068-1) 40/90/21 |
Surface treatment……………………………………………………...... DIP -Nickel Plated
SMD -Matte-tin plated |
| 2R470TB-5 | 2R470SB-5 | 470±20% | 900 | 1000 | 1 | 1 | 10 | 12
|
1) At delivery AQL 0.65 level II, DIN ISO 2859
2) In ionized mode
3) Insulation Resistance Measuring Voltage:
75V at DC 25V
90V~150V at DC 50V
Other at DC 100V
Terms in accordance with ITU-T Rec. K.12, IEC 61643-311, GB/T 9043.
Dimensions (Unit: mm/inch)
DIP Series (2RxxxTB-5)
SMD Series (2RxxxSB-5)
Packaging Information (Unit: mm/inch)
Packaging Quantity
100 PCS per Plastic Tray
5 Plastic Trays per inner box
500 PCS per inner box
Axial Packaging (Tape & Reel)
Soldering Parameters - Wave soldering (Thru-Hole Devices)
| Wave Soldering Condition | Pb-Free assembly |
| Preheat | Temperature Min | 100°C |
| Temperature Max | 150°C |
| Time (Min to Max) | 60-180 Seconds |
| Solder Pot Temperature | 280°C Max |
| Solder Dwell Time | 2-5 Seconds |
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
| Reflow Condition | Pb - Free assembly |
| Preheat | -Temperature Min (Ts(min)) | 150°C |
| -Temperature Max (Ts(max)) | 200°C |
| - Time (min to max) (ts) | 60 -180 Seconds |
| Average ramp up rate ( Liquids Temp TL) to peak | 3°C/second max |
| TS(max) to TL - Ramp-up Rate | 5°C/second max |
| Reflow | - Temperature (TL) (Liquids) | 217°C |
| - Time (min to max) (ts) | 60 -150 Seconds |
| Peak Temperature (TP) | 260 +0/-5°C |
| Time within 5°C of actual peak Temperature (tp) | 10 - 30 Seconds |
| Ramp-down Rate | 6°C/second max |
| Time 25°C to peak Temperature (TP) | 8 minutes Max |
| Do not exceed | 260°C |
